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High-Frequency RO3003 PCB – 2-Layer 5mil with ENIG Finish for RF and Microwave Applications


1. Introduction to RO3003 High-Frequency Laminate

Rogers RO3003 is a ceramic-filled PTFE composite engineered for commercial microwave and RF applications. It delivers exceptional dielectric constant (Dk) stability across temperature and frequency variations, eliminating the Dk step change observed in standard PTFE glass materials. This makes it ideal for:
Automotive radar systems (77 GHz)
ADAS (Advanced Driver Assistance Systems)
5G wireless infrastructure (mmWave frequencies)
Satellite communications and high-speed RF designs


2.PCB Construction Details

Parameter Details
Base Material Rogers RO3003 high-frequency laminate
Layer Count 2 layers
Board Dimensions 69.25mm × 92.45mm (2 types, 2 pieces)
Critical Design Rules Trace/Space: 5/5 mils minimum
Minimum Hole Size: 0.2mm
No Blind/Buried Via
Thickness & Copper Finished Thickness: 0.2mm
Copper Weight: 1 oz (35µm) outer layers
Via Plating: 20µm
Surface Finish Immersion Gold (ENIG)
Solder Mask Green (top only)
Silkscreen None
Testing 100% electrical test prior to shipment

3. PCB Stackup (2-Layer Rigid Construction)

Layer 1: Copper (35µm)
Core: Rogers RO3003 substrate (5mil / 0.127mm)
Layer 2: Copper (35µm)



4.PCB Statistics:

Components: 21
Total Pads: 63
Thru Hole Pads: 37
Top SMT Pads: 26
Bottom SMT Pads: 0
Vias: 51
Nets: 2


5. Manufacturing & Compliance Specifications

Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class-2 compliant
Global Availability: Worldwide production and shipping


6.Key Electrical & Mechanical Properties

Dielectric Constant (Dk): 3.00 ±0.04 @ 10 GHz/23°C
Dissipation Factor (Df): 0.001 @ 10 GHz
Thermal Performance:
Decomposition Temp. (Td): >500°C
Thermal Conductivity: 0.5 W/mK
Moisture Absorption: 0.04%
CTE (Coefficient of Thermal Expansion):
X/Y-Axis: 17/16 ppm/°C (matches copper)
Z-Axis: 25 ppm/°C


7.Advantages for RF/Microwave Designs

Ultra-Low Loss: Suitable for 77 GHz automotive radar and mmWave 5G.
Stable Dk vs. Temp/Freq: Ensures consistent performance in filters, patch antennas, and oscillators.
Reliable Multilayer Compatibility: Hybrid designs with epoxy-glass PCBs.
Copper-Matched CTE: Reduces thermal stress for SMT assemblies.


8. Typical Applications

Automotive: Radar, ADAS sensors
Telecom: 5G base stations, power amplifiers
Aerospace: GPS antennas, satellite comms
High-Speed Digital: Backplanes, datalinks


 

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